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6th EUROPEAN THERMOFORMING CONFERENCE in Berlin from 3rd till 5th April, 2008

The "6th European Thermoforming Conference", organized by the Society of Plastics Engineers Europe, was held in Berlin from 3rd April till 5th April, 2008.

Experts of the thermoforming industry from all over the world were represented at the conference to catch up on the latest product developments and services which were presented by some of the leading supplier in the thermoforming industry.

HEKUMA also represented its latest developments in Thermoforming-IML and Blister Decorating Application (BDA) with integrated RFID. Those developments created great interest among the visitors of the conference.